Visit us at DAC in San Francisco – July 27 though July 30

Come and see us at the Design Automation Conference (DAC) in San Francisco July 27 through July 30.  We are booth number 1522.

ViASIC’s Place and Route Technology Chosen by Achronix Semiconductor

RESEARCH TRIANGLE PARK, N.C. – Oct. 7, 2008 – ViASIC Inc., an electronic design automation (EDA) company with breakthrough tools, IP and services for reconfigurable semiconductor fabrics, today announced that Achronix Semiconductor Corp. selected ViASIC’s ViaPath™ place and route software for use in its Achronix CAD environment (ACE).  ViASIC believes ViaPath is the only commercially [...]   Read More »

ViASIC Names J. Mark Goode as President and Chief Executive Officer

RESEARCH TRIANGLE PARK, N.C. – Mar. 3, 2008 – ViASIC Inc., an electronic design automation (EDA) company that offers breakthrough tools, IP and services for reconfigurable semiconductor fabrics, today announced the promotion of J. Mark Goode to president and chief executive officer, effective immediately.  Goode brings 17 years of solid experience to this role, spanning [...]   Read More »

ViASIC Names Lynn Hayden President and CEO

RESEARCH TRIANGLE PARK, N.C. – Sept. 13, 2007 - ViASIC Inc., an electronic design automation (EDA) company that offers breakthrough tools, IP and services for reconfigurable semiconductor fabrics, today announced the appointment of Lynn Hayden as president and chief executive [...]   Read More »

Subject: ViASIC ViaPath/ViaMask Deep Chip #
Structured ASICs are "not dead yet" Cooley's Wiretap #
DAC Preview: Physical Design and Analysis Electronic Design #
Configurable SoCs speed turnaround EE Times #

ViASIC Introduces Industry’s First Two-Mask Standard Metal Fabric for Re-configurable SOC Design

Research Triangle Park, NC – June 30, 2006 – ViASIC, Inc., the leading provider of standard-metal technologies, today announced DuoMask, a high-density, high performance two-layer standard-metal fabric for [...]   Read More »

Firm offers two-mask standard metal fabric for re-configurable SoCs EE Times #
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